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Tungsten-Copper Heat Sinks
They are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc. Here is what our customers say about us!
Advantages
- High thermal conductivity
- Excellent hermeticity
- Excellent flatness, surface finish, and size control
- Semi-finished or finished (Ni/Au plated) products available
NEW - Copper Tungsten Heat Sinks Off The Shelf - click here
Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.
For product and pricing information, please click here.
Physical and Mechanical Properties
| Material | W90Cu10 | W88Cu12 | W85Cu15 | W80Cu20 | W75Cu25 |
|---|---|---|---|---|---|
| Tungsten Content (wt%) | 90 ¡À 1 | 88 ¡À 1 | 85 ¡À 1 | 80 ¡À 1 | 75 ¡À 1 |
| Density at 20¡ãC (g/cm3) | 17.0 | 16.8 | 16.3 | 15.6 | 14.9 |
| Coefficient of thermal expansion at 20¡ãC (10-6/K) | 6.5 | 6.7 | 7.0 | 8.3 | 9.0 |
| Thermal conductivity at 25¡ãC/100¡ãC (W/mK) | 180 - 190 | 185 - 195 | 190 - 200 | 200 - 210 | 220 - 230 |
| Specific heat at 100¡ãC(J/kgK) | 160 | 168 | 174 | 195 | 211 |
| Specific electrical resistance at 20¡ãC (¦Ì¦¸m) | 0.045 | 0.043 | 0.04 | 0.034 | 0.029 |
| Young's modulus at 20¡ãC(Gpa) | 330 | 320 | 310 | 280 | 256 |
| Vickers hardness (HV 10) | 300 | 290 | 280 | 260 | 240 |