Cu/Mo/Cu Heat Sinks (CMC)

Cu/Mo/Cu heat sinksCu/Mo/Cu (CMC) is a sandwiched composite comprising a molybdenum core layer and two copper clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc. Here is what our customers say about us!

Advantages

  • Large size sheets available (length up to 400mm, width up to 200mm)
  • Can be stamped into components
  • Very strong interface bonding that can resist 850ˇăC heat shock repeatedly
  • Adjustable CTE matching that of semiconductor and ceramic materials
  • High thermal conductivity
  • No magnetism

Technical Data

Cu/Mo/Cu

Density (g/cm3)

CTE (ppm/K)

Thermal Conductivity, W/m.K

In-Plane

Thru-Thickness

13:74:13

9.88

5.6

200

170

1:4:1

9.75

6.0

220

180

1:3:1

9.66

6.8

244

190

1:2:1

9.54

7.8

260

210

1:1:1

9.32

8.8

305

250