Cu/Mo/Cu Heat Sinks (CMC)
Cu/Mo/Cu (CMC) is a sandwiched composite comprising a molybdenum core layer and two copper clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.
Advantages
- Large size sheets available (length up to 400mm, width up to 200mm)
- Can be stamped into components
- Very strong interface bonding that can resist 850ˇăC heat shock repeatedly
- Adjustable CTE matching that of semiconductor and ceramic materials
- High thermal conductivity
- No magnetism
Technical Data
Cu/Mo/Cu |
Density (g/cm3) |
CTE (ppm/K) |
Thermal Conductivity, W/m.K |
|
|---|---|---|---|---|
In-Plane |
Thru-Thickness |
|||
13:74:13 |
9.88 |
5.6 |
200 |
170 |
1:4:1 |
9.75 |
6.0 |
220 |
180 |
1:3:1 |
9.66 |
6.8 |
244 |
190 |
1:2:1 |
9.54 |
7.8 |
260 |
210 |
1:1:1 |
9.32 |
8.8 |
305 |
250 |