Cu/Mo70Cu/Cu Heat Sinks (CPC)
Cu/Mo70Cu/Cu (CPC) is a sandwiched composite similar to Cu/Mo/Cu comprising a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu Mo70Cu and Cu layers is 1:4:1. It has different CTEs in the X and the Y direction. Its thermal conductivity is higher than those of W/Cu, Mo/Cu, Cu/Mo/Cu and it is much cheaper.
Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.
Advantages
- Large size sheets available (length up to 400mm, width up to 200mm)
- More easily to be stamped into components than CMC
- Very strong interface bonding that can resist 850ˇăC heat shock repeatedly
- Higher thermal conductivity and lower cost
- No magnetism
Technical Data
Cu/Mo70Cu/Cu |
Density (g/cm3) |
CTE (ppm/K) |
Thermal Conductivity (W/m.K) |
||
|---|---|---|---|---|---|
X Direction |
Y Direction |
In-Plane |
Thru-Thickness |
||
1:4:1 |
9.46 |
7.2 |
9.0 |
340 |
300 |